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Silicone-Free Thermal Pad

Features and Benefits

◇ 2.00 W/mk  thermal conductivity 
◇ Silicone-Free Thermal Pad
◇ Naturally tacky for easy applicaiton
◇ Electrically insulating

Typical Application:
◇ Network Equipement, Mass Storage devices
◇ Industrial Automation, Telecom Device.
◇ Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.

TYPICAL PROPERTIES OF TCSF200
PROPERTY METRIC VALUE TEST METHOD
Composition Acrylic ----
Color  Grey Visual
Thickness (mm) 0.5 to 5 ----
Hardness (Shore 00) 60 ASTM D2240
Density (g/cc) 3.13 ASTM D792
Heat Capacity(1/g-K) 1.1 ASTM E1269
Outgassing TML 0.12% ASTM E595
Outgassing CVCM 0.06% ASTM E595
Continuous Use Temp () -60 to 200 EN344
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 200 Vac/mil ASTM D149
Volume Impedance (ohm-cm) 6.0 x109 ASTM D257
Flame Rating V 0 UL 94
THERMAL
Thermal Conductivity (W/m.k)  2.0  ASTM D5470

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Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com  
Address: Rm#911-912,Block 12, Huayao BLG, No.1 Pingan Road, Pinghu Town, Longgang district, Shenzhen City, P.R.China 518111