Heat Conductive Materials Offers the Following Characteristics
High heat dissipation ability due to the use of Boron Nitride compounds.
Silicone-based heat conductive materials contain high percentage of thermally conductive fillers.
Exhibit outstanding thermal performance and stability when filling the gap between the heat-generating device and its corresponding heatsink.
Designed to dissipate heat and provide electrical insulation for power transistors, power modules, CPU's, GPU's, NorthBridge and other electrical components.
Available in several different thicknesses, allowing the materials to be used in applications where the two mating surfaces of the assembly are either irregular or non-coplanar.
A wide usable temperature range.
Easily applied and removed as a temporary attachment.
Excellent tear strength due to glass cloth reinforcement.
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