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Thermal Conductive Tape


Features and Benefits

-All of our Thermal Conductive Adhesive Tape is used for bonding heat disspation fins to microprocessor or power consumption semiconductors, utlimate bonding strength with lower thermal resistance without mechanical fixing for assembly
-Double-sided, pressure sensitive adhesive tape 
-Electrically insulating

Typical Application:

- Mount heat sink/spreader onto drive process(BGA)/power converter or Motor control PCB
- In all applications where a metal/plastic housing is used as heatsink without screw or clip mounting and hot-melt glue

Typical Properties of Thermal Conductive Adhesive Tape
Properties Units TCT120 TCT120FG Test Method
Color --- White  White Visual
Reinforcement Carrier --- No Fiberglass ---
Thickness Range mm 0.15 0.25 0.15 0.2 0.25 0.3 ---
natural tacky (1- or 2-sided) --- 2 2 2 2 2 2 ---
Continuous Use Temp -20 to 100 EN344
ELECTRICAL
Breakdown Voltage Kv/mm 2 4 2 2.5 3.5 4 ASTM D149
Peel  Adhesion N/25mm 9.5 11 10.3 11.8 14.5 15.8 PSTC-7
Holding Adhesion N/25mm/25 10.2 11.8 12.2 14.5 16.8 18 PSTC-7
THERMAL
Thermal Conductivity W/m.k 1.2  1.2  1.2 1.2  1.2 1.2 ASTM D5470

Note:   Standard sheet: 1000mm x 25 or 50M , Custom configuration Available

Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com  
Address: Rm#911-912,Block 12, Huayao BLG, No.1 Pingan Road, Pinghu Town, Longgang district, Shenzhen City, P.R.China 518111