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Thermally conductive polyimide film:

It is a homogeneous film possessing three times the thermal conductivity and cut strength of standard generous-purpose polyimide film; Its thermal conductivity property combines the characteristic of high temperature resistance makes it ideal for usage in controlling and managing heat in electronic assemblies; It extends the storage life of electronic components at temperatures between 0 and 30°C as packaging material.

Feature:

Higher thermal conductivity

Halogen-free,environment-friendly.

Application:

Ceramic board replacement

Insulation pads (heat sink)

Thickness range:

Thickness available:25um 38um 50um 75um

(others are also available to be customized if needed)

Typical Properties:

Item Typical Value
Appearance Smooth surface,uniformed color ,even edge without damage
Type HT36110
THK 25±3μm
Tensile Strength MD ≥125Mpa
TD ≥110Mpa
Elongation MD ≥30%
TD ≥40%
Thermal Conductivity ≥0.36 W/m.k
Roll width 520mm
Standard Length 1500m
Transmittance ≤0.1%
Surface Resistivity 1.0×1013Ω
Dielectric Strength ≥4.0KV

Contact Us

Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: sales@sg-thermal.com  
Address: Rm#911-912,Block 12, Huayao BLG, No.1 Pingan Road, Pinghu Town, Longgang district, Shenzhen City, P.R.China 518111